| 摘要 |
PURPOSE:To finely process the size of minute particles in the title porous silicon with high precision as well as stabilizing the surface composition without decreasing the light emitting efficiency in relation to the size controlling method of the porous silicon and the stabilization of the surface composition. CONSTITUTION:The title manufacturing method of porous silicon is composed of the three steps enumerated as follows, i.e., the first step of forming a porous silicon 2 to be the base on the surface of a silicon wafer 1, the second step of forming oxide layers 3 by chemically oxidizing the porous silicon 2 using a solution and the third step of contracting the porous silicon 2 by removing the oxide layers 3 in the reducing step. |
