| 摘要 |
PURPOSE:To provide a wire bonding device and its method for wiring a semiconductor element and a lead positively. CONSTITUTION:In the title wire bonding device 1, a lead frame where a semiconductor element 10 is mounted is laid out at a specified position of a heat plate 2 and a guide corresponding to the spacing of each bonding wire 7 is provided at a support part 5 which protrudes from an area between a die pad 3 and a lead 4 so that it can move up and down freely. Also, in the title wire bonding method, the lead frame where the semiconductor element 10 is connected is laid out on the heat plate 2 and the bonding wire 7 is led about along the guide of the support part 5 protruding at a specific height. |
