| 摘要 |
PURPOSE:To improve the bonding between bonding wires and a lead frame and between the lead frame and resin by forming corrugations at the free end portions of a plurality of leads. CONSTITUTION:An etching step or press step of forming corrugations, grooves parallel to the lead pattern or through holes at the distal end portions of inner leads 4, is added to the process for fabricating lead frame 7. With this lead frame 7 used in a semiconductor device, pressure-bonded portions between bonding wires 6 of Au, Al or the like and the lead frame 7 have heavy pressure- bonded portions and light pressure-bonded portions. As a result, the bonding between the bonding wires 6 and the lead frame 7 is enhanced, preventing the wires 6 from being cut due to a slight environmental change. Because of this shape of the lead frame 7, the surfaces of the inner leads 4 become rougher to improve the bonding between the lead frame 7 and resin. The lead frame 7 therefore is not affected by an environmental change and have a high reliability. |
