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发明名称
MOLDING APPARATUS FOR MOLD PART IN SEMICONDUCTOR COMPONENT
摘要
申请公布号
JPH0621119(A)
申请公布日期
1994.01.28
申请号
JP19920177046
申请日期
1992.07.03
申请人
ROHM CO LTD
发明人
TSUJI MASAHIRO
分类号
H01L21/56;(IPC1-7):H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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