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经营范围
发明名称
RESIN SEALING METHOD
摘要
申请公布号
JPH0613420(A)
申请公布日期
1994.01.21
申请号
JP19920169043
申请日期
1992.06.26
申请人
OKI ELECTRIC IND CO LTD
发明人
OKUAKI YUTAKA
分类号
H01L21/56;(IPC1-7):H01L21/56
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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