发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To provide a photosensitive resin compsn. contg. easily available and easily introduced photosensitive groups, having satisfactory shelf stability, heat stability, practical physical properties and sensitivity and not causing cracking at the time of development. CONSTITUTION:This photosensitive resin compsn. consists of 100 pts.wt. polyimide, 10-100 pts.wt. isocyanurate contg. a (meth)acrylic group, 10-100 pts.wt. polyalkylene glycol di(meth)acrylate and 0.5-20 pts.wt. photopolymn. initiator. This compsn. is easily produced, maintains satisfactory practical sensitivity even to a thick film and hardly undergoes a change in the film thickness with the lapse of time or a change in the sensitivity.
申请公布号 JPH0611830(A) 申请公布日期 1994.01.21
申请号 JP19920190155 申请日期 1992.06.25
申请人 CHISSO CORP 发明人 KATO KOICHI;WATANABE EIJI;KUNIMUNE KOICHI
分类号 C08F2/50;C08F2/48;C08F20/10;C08F20/34;C08F220/20;C08F220/38;C08F290/00;C08F299/02;C08G18/79;C08G18/81;C08L79/08;G03F7/027;G03F7/037;H05K1/00;(IPC1-7):G03F7/037 主分类号 C08F2/50
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