发明名称 |
Stacked capacitor DRAM - has wiring layer which is used for top electrode of storage capacitor and for connecting to peripheral circuit in region separate from that contg. memory cell |
摘要 |
Each memory cell on the substrate (10) consists of a capacitor with a top and a bottom electrode with an intermediate insulating layer and a MOSFET. On the substrate is formed a peripheral circuit section in a region different from that contg. the memory cell section. A wiring layer (27,29) serves as the capacitor top electrode. The wiring layer also serves the peripheral circuit section. It consists of a first (27) and a second layer (29), the first one of polycrystalline silicon, TiN, Ni and carbon. The second one is of WSi2, W, Ni, Al, and Cu, or is a multiple layer of selected Ti compounds. USE/ADVANTAGE - For data or information signal DRAM, with simple connection to substrate in peripheral circuit section contact hole.
|
申请公布号 |
DE4323961(A1) |
申请公布日期 |
1994.01.20 |
申请号 |
DE19934323961 |
申请日期 |
1993.07.16 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP |
发明人 |
OZAKI, TOHRU, TOKIO/TOKYO, SHINAGAWA, JP;TAKATO, HIROSHI, WAPPINGERS FALLS, N.Y., US;NITAYAMA, AKIHIRO, WAPPINGERS FALLS, N.Y., US |
分类号 |
H01L21/28;H01L21/768;H01L21/822;H01L21/8242;H01L23/522;H01L27/04;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L27/108;H01L23/532;G11C11/407 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|