发明名称 Stacked capacitor DRAM - has wiring layer which is used for top electrode of storage capacitor and for connecting to peripheral circuit in region separate from that contg. memory cell
摘要 Each memory cell on the substrate (10) consists of a capacitor with a top and a bottom electrode with an intermediate insulating layer and a MOSFET. On the substrate is formed a peripheral circuit section in a region different from that contg. the memory cell section. A wiring layer (27,29) serves as the capacitor top electrode. The wiring layer also serves the peripheral circuit section. It consists of a first (27) and a second layer (29), the first one of polycrystalline silicon, TiN, Ni and carbon. The second one is of WSi2, W, Ni, Al, and Cu, or is a multiple layer of selected Ti compounds. USE/ADVANTAGE - For data or information signal DRAM, with simple connection to substrate in peripheral circuit section contact hole.
申请公布号 DE4323961(A1) 申请公布日期 1994.01.20
申请号 DE19934323961 申请日期 1993.07.16
申请人 KABUSHIKI KAISHA TOSHIBA, KAWASAKI, KANAGAWA, JP 发明人 OZAKI, TOHRU, TOKIO/TOKYO, SHINAGAWA, JP;TAKATO, HIROSHI, WAPPINGERS FALLS, N.Y., US;NITAYAMA, AKIHIRO, WAPPINGERS FALLS, N.Y., US
分类号 H01L21/28;H01L21/768;H01L21/822;H01L21/8242;H01L23/522;H01L27/04;H01L27/10;H01L27/105;H01L27/108;(IPC1-7):H01L27/108;H01L23/532;G11C11/407 主分类号 H01L21/28
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