| 摘要 |
PURPOSE:To enable a polishing amount to be adjusted with high accuracy through simple and inexpensive constitution. CONSTITUTION:In a polishing method whereby a sample holder 13 having sample mounting surface faced to the grinder 11 of a polishing device is kept near the grinder 11, and a sample 12 mounted on the sample mounting surface is polished to the predetermined thickness, at least one chip having such thickness as approximately equal to the predetermined post-process thickness of the sample 12 to be polished, and further having a slower polishing rate than the sample 12, is provided on the sample mounting surface in such a way as adjacent to the sample 12. In addition, the polishing method is so constituted that a polishing process continues slightly longer than the scheduled polishing time of the sample 12, thereby polishing the sample 12 to the substantially predetermined thickness. |
