| 摘要 |
PURPOSE:To connect a bare chip IC to a circuit board with high reliability by sufficiently supplying adhesive to a periphery of a bump, a wiring layer when the IC is face bonded onto the board with the adhesive, and eliminating remainder of foam in the adhesive after the adhesive is cured. CONSTITUTION:A circuit board 6 has a supporting board 5, a wiring layer 4 formed on the board 5 and a bump 3 formed at an end of the layer 4 to connect a bare chip IC 2 to face bond the IC 2 with adhesive 7, and comprises a dummy pattern 10 between adjacent layers 4 or a shape of an end of the layer 4 is formed in a wedge state or a circular arc state. Or, as a pressurizing tool to be used in the case of face bonding, the tool in which a recess is provided on a pressurizing surface is used. |
