| 摘要 |
<p>A method of affixing a passive dielectric component (10) e.g. a dielectric resonator to a printed circuit board (16) comprises the steps of forming a metallised area (14) on the p.c.b. separate from the printed electrical circuitry, forming a like metallised area (12) on the component, applying solder material (18) to one of the metallised areas, placing the component on the metallised area on the board and reflowing the solder to create a metal-solder-metal bond between the component and the p.c.b. A metal or dielectric spacer may be positioned between the component and the p.c.b, which spacer is soldered to the p.c.b. and adhesively attached to the component. <IMAGE></p> |
