| 摘要 |
A process for making a metal wall enclosure of a package for housing an electronic element. An elongated strip, to be formed as the metal sidewall of the enclosure, and a bottom plate, for closing an open end of the metal sidewall, are formed from a sheet of metal stock. At least one aperture is selectively provided in at least one of the bottom plate and the planar metal strip. The strip is prepared for folding, such as by transverse grooves formed in the strip along predetermined fold lines corresponding to corners of the metal sidewall, to facilitate folding of the strip into the desired configuration of the metal sidewall and with the opposite ends of the strip, as folded to form the metal sidewall, in abutting relationship. The abutting ends of the metal strip, as folded to form the metal sidewall, are affixed and hermetically sealed together and the lower edge of the metal sidewall, as formed from the folded strip, is affixed and hermetically sealed to the bottom plate to complete the metal wall enclosure. The at least one aperture is at a predetermined position in the metal wall enclosure and of a size for receiving a connector for providing a connection therethrough, and thus from the exterior of the package and through the enclosure, to the electronic element housed within the package.
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