POLYAMINO-OLIGOMER AND POLYMALEIMIDE COMPOUND.

摘要

A polyamino-oligomer comprising repeating units having an indan skeleton, prepared by the reaction of a diisopropenylbenzene or a bis( alpha -hydroxyisopropyl)benzene with an aniline in the presence of an acid catalyst. The oligomer is used as a curing agent for resins to be used for making laminates and, in addition, it is reacted with maleic anhydride to give a polymaleimide compound. This compound has a low melting or softening point and can provide a thermosetting resin composition suitable for manufacturing copper-clad laminates by compounding with a reactant which forms a three-dimensional cross-linkage, such as triallyl isocyanurate or an aromatic diamine. The obtained laminate is lowly dielectric, heat-resistant and lowly water-absorbent, and is useful for making multilayer printed wiring boards.