发明名称 Method for fabricating a semiconductor transistor and structure thereof
摘要 A method for fabricating a CMOS field effect transistor with LDD (light doped drain) structure is disclosed. A first gate for an NMOS transistor and a second gate for a PMOS transistor are formed on a semiconductor substrate, and the NMOS and PMOS transistor regions are subjected to different ion implantation processes so as to form a first source and drain of low concentration. After forming a first spacer on the side walls of the gates, the substrate is subjected to another ion implantation so as to form a second source and drain of high concentration for the NMOS transistor. After forming a second spacer on the side surfaces of the first spacers, the substrate is subjected to still another ion implantation so as to form a second source and drain of high concentration for the PMOS transistor. Then is obtained a CMOS transistor provided with a PMOS transistor of LDD structure without increasing the diffusion resistance of an NMOS transistor.
申请公布号 US5278441(A) 申请公布日期 1994.01.11
申请号 US19910684795 申请日期 1991.04.15
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 KANG, YOUNG-TAE;KANG, RAE-KU;NHO, BYOUNG-HYEOK
分类号 H01L21/336;H01L21/8238;H01L27/092;H01L29/78;(IPC1-7):H01L27/02;H01L21/265 主分类号 H01L21/336
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