Method of forming bonding bumps by punching a metal ribbon

摘要

Disclosed is a method of forming bonding metal bumps on electrodes of a submount for use with an optical device array. Small bonding metal pieces are arranged on a transfer piece resting substrate so as to be aligned with the electrodes of the submount. Next, the bonding metal pieces thus arranged are transferred onto respective electrodes of the submount. In one embodiment, bonding metal pieces are preferably formed by punching a ribbon-shaped bonding metal and respectively fixed by a force of the punching operation directly onto the electrodes of the submount.