Method of manufacturing an optical module using a mold die

摘要

A method of manufacture of an optical module using a mold die including cavity portions for holding an optical connector, electronic circuit parts, and lead pins which constitute component parts of the optical module, so as to form a package. The mold die has alignment portions in which rectangular channels for aligning the optical connector are formed. Partition plates are disposed vertically between the cavity portions and the alignment portions and adapted to prevent a resin from flowing out from the cavity portions during the resin molding. An optical connector, circuit parts, and lead pins are held in the die. Resin is injected into the cavity portion to form the optical module.