Semiconductor device, resin for sealing same and method of fabricating same.

摘要

There is disclosed a semiconductor device wherein electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5 x 10<-><6> to 25 x 10<-><6> when hardened. The semiconductor device provides for direct sealing of the components, whereby its size and cost are reduced.