AIRTIGHT ELECTRONIC COMPONENT USING GLASS CERAMIC SUBSTRATE

摘要

PURPOSE:To provide an airtight electric component of good airtightness and durability which is manufactured by using low temperature baked glass ceramic. CONSTITUTION:The title device is provided with a low temperature baked glass ceramic substrate 1 which holds an electronic component chip 4 to be airtightly contained and a lid part 8 for airtight sealing. The lid part 8 is adhered to the substrate 1 by using glass whose quality is the same as that of glass element contained in the substrate 1 or low melting point glass as adhesive 7.