| 摘要 |
<p>PURPOSE:To prevent the contact between the metallic fine wire stuck to a flexible resin film and a semiconductor chip. CONSTITUTION:A semiconductor chip 4, on one side of which bumps 4a being a plurality of electrodes are formed, is installed in the recess of a mount base 2, where a recess 2a with an opening area capable of accommodating the semiconductor chip 4 and a thickness a little larger than that of the semiconductor chip is made, and the positioning with the metallic fine wire 5a provided on the flexible resin film 5 arranged on its top is performed, and then it is bonded by pressing a bonding tool 3, which has heating and pressurizing means, fast against the metallic fine wire.</p> |
