发明名称 BONDING APPARATUS
摘要 PURPOSE:To regulate the mounting position of a capillary so as to be optimum even when the capillary is replaced by installing a height regulation means which prevents the capillary inserted into a horn from being inserted at a certain height or higher. CONSTITUTION:In a bonding apparatus, a capillary 3 is gripped, held and fixed in a state that the capillary 3 has been inserted into a through hole 7 which has been made in a horn 1. In the bonding apparatus, a ring-shaped, bar-shaped or pin-shaped protrusion 8 is installed at the upper part of the through hole 7 so that the capillary 3 cannot be inserted at a certain height or higher.
申请公布号 JPH05343463(A) 申请公布日期 1993.12.24
申请号 JP19920149742 申请日期 1992.06.10
申请人 HITACHI LTD;HITACHI TOKYO ELECTRON CO LTD 发明人 SAGAWA TETSUYA
分类号 H01L21/60 主分类号 H01L21/60
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