| 摘要 |
PURPOSE:To form a ceramic package capable of dealing with a high density wiring used for a large power LSI package by disposing a plurality of lines of the electric pads on the same flat plane around a semiconductor device mounting part. CONSTITUTION:An LSI 13 is mounted on the upper surface of a ceramic substrate 10, and is connected with electrode pads 15 (inside electrode pad) and 16 (outside electrode pad) disposed into two lines through a wire 14. The electrode pad 15 is used for signal wiring, and the electrode pad 16 is used for power supply wiring and for ground wiring. Since the two lines of the electrode pads are disposed on the same flat plane these electrode pads can be formed even in a thin film process which uses a mask, and can satisfactorily deal with high density wiring. Further, the power supply and ground wiring electrode pads are made larger in their sizes by disposing them into two lines, and hence wiring characters cart be made thick and short to reduce inductance between the power supply and ground wirings and further increase the pitch of an internal wiring. |
