| 摘要 |
PURPOSE:To decide the nondefective or defective state of mounting of an electronic component rapidly with high accuracy without being subject to the effect of the warpage of a circuit board, the displacement, dimensional tolerance of the electronic component within a tolerance, etc. CONSTITUTION:The height data of electronic components 12a, 12b mounted are arithmetically operated by an image arithmetic processing section while the minimum value of the height of the surface of a printed circuit board 11 at a time when the inside of a sub-mask moved on the top faces of the electronic components 12a, 12b in masks set to the electronic components 12a, 12b by a signal processing section is scanned and the maximum value of the height of the electronic components 12a, 12b are compared with a preset threshold, thus deciding the nondefective or defective state of arrangement. |
