发明名称 HIGH DENSITY PIN COMPONENT AND MOUNTING METHOD THEREFOR
摘要 PURPOSE:To provide a high density pin component easily to be wired and a method for mounting the same by alleviating a limit of the pin density. CONSTITUTION:A high density pin component 10 has at least two types of connecting pins having different lengths of the pins. In order to mount it, the component 10 having at least two types of the pins having different lengths is connected to a multilayer circuit board through an insert port having a depth adapted for a length of the pin. Since the components having a structure in which lengths of the pins are different are used, they can be suitably connected to the layers of the circuit board as required so as to mount it. Accordingly, even if the pin densities of the components are the same, utilization of mutual wirings is increased, and hence its mounting density can be increased.
申请公布号 JPH05343592(A) 申请公布日期 1993.12.24
申请号 JP19920149637 申请日期 1992.06.09
申请人 OKI ELECTRIC IND CO LTD 发明人 MATSUNO TAKAKAZU
分类号 B23P21/00;H01G4/228;H01L23/50;H05K3/46;H05K13/04 主分类号 B23P21/00
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