| 摘要 |
A circuit element mounting system and method capable of utilizing data from a CAD device for mounting a circuit element on a printed circuit board to permit mounting in high density or concentration. The system and method include a mounting head for holding a circuit element thereon and mounting it on a printed circuit board. Also, the system and method include controlling moving of the mounting head to a predetermined position on the printed circuit board, depending upon circuit element mounting data input thereto, to thereby cause the mounting head to mount the circuit element on the printed circuit board in a correct manner. |
