| 摘要 |
<p>PURPOSE:To avoid direct contact between a wafer surface and a wafer carrying stand to prevent damage to the wafer surface, occurrence of abrasion dust or transfer of dust from a groove side of the wafer carrying stand to the wafer due to the direct contact. CONSTITUTION:At least a part in contact with a groove 2 of a wafer carrying stand 1 has a diameter larger than that of a wafer 3 to hold the wafer 3 in contact with a rear of the wafer 3 and is inserted and held in the groove of the wafer carrying stand 1.</p> |
