发明名称 |
Heat sink device for components of the SMD type mounted on a printed curcuit board. |
摘要 |
A device for dissipating heat for a surface mount component assembled onto a printed circuit board is made up by a metallic plate deposited on the rear of the substrate under the surface mount component. A thermal coupling device is made up by a small heat collecting plate provided on the front side of the substrate and the actual substrate. The heat collecting plate also performs an electro-magnetic shielding function and is advantageously constituted either by the shielding plate normally provided for this purpose or by an extension thereof. |
申请公布号 |
EP0407957(B1) |
申请公布日期 |
1993.12.22 |
申请号 |
EP19900113132 |
申请日期 |
1990.07.10 |
申请人 |
ALCATEL BUSINESS SYSTEMS |
发明人 |
MALAURIE, CLAUDE;BERTET, JOEL |
分类号 |
H01L23/36;H01L23/552;H05K1/02;H05K1/18;H05K3/34;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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