| 摘要 |
This invention relates to an method and apparatus for soldering microelectronic lead connections to pads on a ceramic substrate with the aid of a fiber based Neodymium:yttrium-aluminum-garnet (Nd:YAG) laser. Such structures of this type, generally, provide a means of delivering sufficient localized heating to the ceramic substrate to reflow solder plate or melt solder cream (paste) within the lead connection without any substrate preheating.
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