| 摘要 |
PURPOSE:To manufacture a wiring board with a good dimensional position accuracy of pattern, by installing a prepreg made of a substrate having specific shrinkage and tensile strength on an inner layer material and performing a stack molding with an outer layer material of the most outer layer. CONSTITUTION:Any resin can be generally adopted as a resin used in an inner layer material, a prepreg and an outer layer material. If necessary, an inorganic powdered filler or a fibrous filler can be contained. Woven fabric, nonwoven fabric, mat, paper, etc., such as an inorganic fiber (for example, glass or asbestos), an organic fiber (for example, polyester or polyamide) and a natural fiber (for example, cotton) can be used as a substrate and the substrate has a shrinkage of 0.8% or less and a tensile strength of 35kg/cm<2> or more. A stacked sheet with a single-sided metal foil, a stacked sheet with double-sided metals, a metal foil, etc., can be employed as the outer layer material. A wiring board is obtained by integrally installing these inner layer material, outer layer material and prepreg. Further, when a plurality of the inner layer materials with a smaller dimension are simultaneously molded using the outer layer material with a large dimension and the prepreg, the more effective result is obtained. |
