| 摘要 |
PURPOSE:To strengthen adhesive strength of a conductor land allowing exchange of the parts with good reliability by forming a wiring pattern part by an additive method while covering at least one part of the periphery of a conductor land with a solder resist. CONSTITUTION:A solder resist 34 to be provided on the periphery of a conductor land is formed so that the peripheral part 13A of the conductor land 13 may be completely covered. Thereby, an opening part 30 of the solder resist 34 is smaller formed than the conductor land 13. Even if a wiring pattern 12 including the conductor land 13 is formed by an additive method (plating or vapor deposition), the adhesive strength of the conductor land 13 can be strengthened by the solder resist 34 conductor land 13 be strengthened by the solder resist 34 covering its peripheral part 13A. As a result, at the time of removing the parts 15 and fresh mounting them in the state where the surface-mounting type parts 15 are connected to the conductor land 13 by solder 16, the conductor land 13 is eliminated to be torn off from a board 10. |
