发明名称 MANUFACTURE OF BOX TYPE RESIN MOLDED OBJECT FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a resin molded object wherein a skin layer of the upper end edge part is polished and the adhesion of a lid body using adhesive agent is increased, by adding a process for performing dry-blasting from an aperture part toward the inside recessed part of a box type resin molded object. CONSTITUTION:After a lead frame 2 is set in a metal mold, resin is injected to obtain a box type resin molded object 1 unified in a body with the lead frame 2. An island part 6 is buried in the recessed bottom 5 of the box type molded object 1. An inner lead part 3 of the lead frame 2 is exposed and arranged on the outside of the recessed part. Dry-blasting is performed from the aperture part toward the inside recessed part of the box type resin molded object 1 obtained in the preceeding process. Further the inside recessed part of the box type molded object 1 is washed. Thereby excellent adhesion is obtained, and wire-bonding to the lead frame can be improved.
申请公布号 JPH05335434(A) 申请公布日期 1993.12.17
申请号 JP19920141823 申请日期 1992.06.02
申请人 MITSUI PETROCHEM IND LTD 发明人 KUWAHATA KENJI;YOSHITAKE JUNICHI
分类号 B29C45/14;B29L31/34;H01L21/56;H01L23/08 主分类号 B29C45/14
代理机构 代理人
主权项
地址