MANUFACTURE OF LOW THERMAL EXPANSION MULTILAYERED BOARD

摘要

PURPOSE:To obtain a manufacturing method of a low thermal expansion multilayered board for a printed wiring board which can be suitably used for mounting semiconductor. CONSTITUTION:An inner layer printed wiring network is formed on a copper- clad multilayered board of non-woven fabric base material using wholly aromatic polyamide fiber whose thermal expansion coefficient is lower than or equal to 10X10<-6>K<-1>. Prepreg for multilayer bonding and a copper foil or a single-sided copper-clad mutilayered board are stacked on the printed wiring surface and heated with pressure.