| 摘要 |
<p>PURPOSE:To improve connectability between an inner interconnection layer and an end electrode while a multilayer circuit board having the end electrode is reduced in size. CONSTITUTION:A multilayer circuit board 1 is chiefly made up of: a board body 2 composed of integrated sheets 2a... 2h that are obtained by laminating a number of ceramic green sheets and calcining the sheets in an integrated fashion; an end electrode 5 formed on the end surface of the board body 2; and inner interconnection layers 3 formed within the board body 2 and connected to the end electrode 5. A tip end 3a of the inner interconnection layer 3 is connected to the end electrode 5, and the tip end 3a is set to be thicker than the other portion of the interconnection layer. This causes a contact area between the end 3a and the end electrode 5 to be increased, and hence it is less likely that a contact failure will occur between the inner interconnection layer 3 and the end electrode 5.</p> |
