| 摘要 |
PURPOSE:To facilitate manufacturing and reduce a manufacturing cost while variation in a resistance value of a resistor is little and the resistance value can be easily adjusted. CONSTITUTION:This wafer 1 is provided with a metal plate 2 and an insulating layer 3 formed in an inner surface thereof. On the insulating layer 3, a resistor 4 generating heat due to current supply, terminals 5, 6 connected respectively to both ends of the resistor 4, a plurality of protruded strips arranged in the periphery and the like of the terminals 5, 6, are formed. The resistor 4, terminals 5, 6 and strips 7 are collectively formed by means of a screen printing method. After the resistor 4 is formed, the metal plate 2 is bent at a bending line 11 in such a way as to position the resistor 4 and the like inside thereof, so as to superpose a resistor formed piece 21 and a resistor non-formed piece 22 on each other, and these are heated and pressure connected to each other, thus completing a wafer 1. |
