| 摘要 |
PURPOSE:To provide an ultrasonic output supplying method for ultrasonic wire bonding in which deterioration of bonding quality due to deterioration of bonding tool is suppressed while increasing the yield. CONSTITUTION:When a gold wire 2 fed from a capillary 1 is bonded to a member 13 to be bonded through ultrasonic bonding, chips 3 of the gold wire 2 adhere to the tip of the capillary and when bonding operation is repeated, the chips move into the tube of the capillary and adhere thereto. Consequently, performance of the capillary deteriorates to cause deterioration of bonding quality. In order to prevent deterioration, output from an ultrasonic oscillator for driving an ultrasonic oscillator is increased depending on the using frequency of the capillary thus increasing ultrasonic output. This method prevents deterioration of bonding quality even if the capillary is deteriorated. |
