| 摘要 |
PURPOSE:To realize a semiconductor package capable of effectively avoiding the propagation of internal noise to external electric circuits through the intermediary of metallized wiring layers so as to eliminate malfunctions of external semiconductor devices. CONSTITUTION:A semiconductor package is composed of an insulating substrate 1 having multiple metallized wiring layers 5 connecting respective semiconductor element 4 to outer electric circuit and a cover body 2 as well as an inner cavity for containing the semiconductor element 4, resitors 8 at the resistance value not exceeding 50OMEGA are connected in series on metallized wiring layers and a grounding metallized layer 9 is arranged in the insulating base substrate 1 as well as a static capacitor exceeding 1.0pF is formed between the metallized layer 9 and the metallized wiring layers 5.
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