| 摘要 |
<p>PURPOSE:To facilitate alignment and to reduce in size an entire device by telescopically providing an optical system member between a holding base to be inspected and contact means, and displaying an image transmitted by the member on aligning image display means. CONSTITUTION:A wafer holding base 2 for holding a semiconductor wafer W formed with many IC chips in a matrix is disposed under a probe card 36, a holding member 4 is disposed between a probe needle 37 and the wafer W, and the image of the needle 37 is transmitted to a camera 43 through a half-mirror M1. A final contact position of an end of the needle is confirmed through the camera 43. The base 2 is so moved by a driving mechanism in directions X, Y, theta that an electrode pad of the chip and the needle 37 are disposed in a predetermined positional relationship while observing a display. Then, after the member 4 is retreated, the base 2 is raised, the needle 37 is brought into contact with the pad to perform an electric measurement.</p> |
