| 摘要 |
PURPOSE:To prevent formation of a bridge or a fringe of solder in soldering of a printed wiring board. CONSTITUTION:In a flow soldering apparatus which has a solder tank 12 for storing molten solder 10 and a jet forming device for forming a jet 22 rising from the liquid surface of the solder 10 stored in the solder tank 12 and in which a printed wiring board 30 is moved in the horizontal direction so that the lower surface of the printed wiring board 30 be brought into contact with the jet 22 of the solder and thereby the solder 10 be fitted on the printed wiring board 30, a fringe preventing former 50 is provided on the downstream side of the jet 22. |
