| 发明名称 |
CERAMIC SUBSTRATE AND ITS MANUFACTURE, AND SUBSTRATE VACUUM-CLAMPING DEVICE USING CERAMIC VACUUM-CLAMPING BOARD |
| 摘要 |
<p>A ceramic substrate for hard disks, thin film chip capacitors, and hybrid ICs, of titanium oxide or aluminum oxide, has an extremely small number of pores of larger than 3 mu m diameter in the surface. The substrate is fabricated by burning finely powdered high-purity titanium oxide or high-purity aluminum oxide in the air, an inert atmosphere at 1,100-1,300 DEG C, or a reducing atmosphere at 1,200-1,400 DEG C and then, subjecting it to an HIP process.</p> |
| 申请公布号 |
WO9324925(A1) |
申请公布日期 |
1993.12.09 |
| 申请号 |
WO1993JP00120 |
申请日期 |
1993.02.02 |
| 申请人 |
NIHON CEMEMT CO., LTD.;NIHON CERATEC CO., LTD. |
发明人 |
KAMIAKA, HIDETO;KISHI, YUKIO |
| 分类号 |
C04B35/111;C04B35/46;C04B35/645;G11B5/73;G11B5/84;H01G4/06;H01G4/08;H01L21/48;H01L23/15;H05K1/03;(IPC1-7):G11B5/82;C04B35/10;B25J15/06 |
主分类号 |
C04B35/111 |
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