Electronic device with large number of leads - has ends of leads fixed to strip of electrically insulating material, e.g. epoxy resin or polyamide

摘要

The electronic device has a large number of thin, closely-spaced leads (3) made from electrically conductive material. The leads are fixed to and insulated from the device or pass through the device. The ends of the leads are fixed to a strip (4) of an electrically insulating material. In one embodiment, the strip is made from a circuit board material, e.g. epoxy resin, which has a solderable or weldable metal layer on the sites to which the leads are fixed. Alternatively, the strip is made from a thermally stable plastics layer, e.g. polyamide film, which covers both sides of the leads. USE/ADVANTAGE - E.g. multichip module package. Prevents leads from being bent before contacting.