发明名称 PREPARATION OF LAMINATED BOARD
摘要 <p>PURPOSE:To obtain a laminated board with excellent mold releasing performance after forming and improved printability by using and laminating the sheet metal where organosilicon prepolymer film is molded on a sheet metal of a metal mold in contact with resin-impregnating dry paper or cloth. CONSTITUTION:Said laminated board is prepared by heating and molding suitable sheets of laminates of thermosetting resin-impregnating paper or cloth on a sheet metal for a metal mold on which organic silicon prepolymer film is formed. For the thermosetting resin is used any thermosetting resin such as phenol resin, epoxy resin, melamine resin, etc. and for the lamination base, woven or unwoven cloth composed of inorganic fiber of glass, asbesto, etc. and organic fiber of polyamide, polyester, etc. are available.</p>
申请公布号 JPS55126420(A) 申请公布日期 1980.09.30
申请号 JP19790035961 申请日期 1979.03.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 FUJII NORIO
分类号 B29C67/00;B29C43/02;B29C43/18;B29C43/20;B29C43/32;B29C43/36;B29C55/00;B29C57/00;B29C63/00;B29C65/70;B29C70/00;B29C70/06;B32B37/00 主分类号 B29C67/00
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