Einbausystem für auf Leiterplatten montierte hochintegrierte gehäuselose Bausteine

摘要

The invention relates to a mounting system for highly integrated and caseless components which are mounted on printed-circuit boards. In the case of LSI components having more than 500 pins and a power loss of more than 50 watts, sufficient dissipation of the heat caused by the high power loss is no longer provided to a sufficient extent by a simple, conventional heat sink. In addition, as a result of the increasing number of connections, making contact between the components and the printed-circuit board is becoming more and more difficult. The invention solves this problem in that the components (4) make contact with a carrier board (6) and these are connected via a first spider (7) to the associated solder lands on the printed-circuit board (9). A highly thermally conductive membrane (2), which projects beyond the component edges on all sides, rests on retaining means which are fitted on the carrier board (6) and thus forms a cavity (10) all round the component (4), is mounted on the component surface. For its part, the membrane rests against a cold plate (1), and the cavity is filled with a cooling fluid which evaporates easily. This results in good spreading of the heat and good cooling effect, as well as the capability to install such components on printed-circuit boards easily.