Dicing-die bonding film and process for producing chips.

摘要

A dicing-die bonding film comprising a substrate having formed on one side thereof a pressure-sensitive layer, a first adhesive layer, and a second adhesive layer comprising a thermosetting adhesive showing tackiness at a temperature 150 DEG C or less in this order, the pressure-sensitive layer and the first adhesive layer being peelable from each other, and a process for producing semiconductor chips utilizing the dicing-die bonding film. <IMAGE>