发明名称 |
Chip electronic device with a resin housing and manufacturing process thereof |
摘要 |
A chip electronic device wherein an electronic element such as an inductor and capacitor, and terminals are covered with a resin housing. Plated lower surfaces and edges of the terminals show on a bottom and sides of a housing respectively. The lower surfaces of the terminals are soldered onto conductive patterns of a printed wiring board, and fillets of solder are formed at the edges of the terminals.
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申请公布号 |
US5266739(A) |
申请公布日期 |
1993.11.30 |
申请号 |
US19920840926 |
申请日期 |
1992.02.25 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
YAMAUCHI, KEISHIRO |
分类号 |
H01C1/14;H01F27/29;H01F41/04;H01G4/224;H01G4/228;H01G4/252;(IPC1-7):H01L23/28;B29B13/00 |
主分类号 |
H01C1/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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