| 摘要 |
<p>PURPOSE:To connect a semiconductor device and a circuit substrate with good reliability by eliminating a thermal stress of setting contraction during thermosetting of sealing resin, a stress to a junction part due to swelling by damping of the sealing resin and a thermal stress to a junction part at a high temperature and a low temperature. CONSTITUTION:A sealing structure wherein volatile solvent is filled into a between a semiconductor device 1 which is packaged on a circuit substrate 2by facedown bonding and the circuit substrate 2, and a periphery thereof is sealed with insulating resin 7, a void 8 is provided by volatilizing the filled volatile solvent and a periphery of the semiconductor device 1 is sealed with the silicone resin 7 to hold the semiconductor device 1 to the circuit substrate 2.</p> |
