| 摘要 |
<p>PURPOSE:To inhibit the generation of a crack, which is generated in a sealing resin, in a resin-sealed semiconductor device of a structure, wherein a plurality of semiconductor chips are housed in one package. CONSTITUTION:1) A semiconductor device is a resin-sealed semiconductor device of a structure, wherein a plurality of semiconductor chips 2 are superposed and are housed in one package, there is a gap between the chips and the gap is filled with a sealing resin A. 2) A semiconductor device is a resin-sealed semiconductor device of a structure, wherein a plurality of semiconductor chips 2 are superposed and are housed in one package, and chamfering parts or roundness parts are respectively provided at the edges of the superposing surfaces of the chips 2. 3) The device is constituted in such a structure that a support material for holding the interval between the chips is provided in a gap between the chips 2.</p> |
