发明名称 RESIN MOLD DEVICE
摘要 PURPOSE:To smoothly separate and remove undesirable curing resin attaching to a lead frame therefrom without applying stress thereto. CONSTITUTION:In a device which moves long hoop-like lead frame 1 after resin mold having an armor resin part 2 to a fixed direction and separates a runner 3 and a gate 4 attaching to a width direction end part of the lead frame 1 which are undesirable curing resin by an undesirable resin separation means arranged in a middle of the movement, the undesirable resin separating means is composed of a pair of upper/lower rollers 11, 12 which hold the lead frame 1 moved in a line from both sides thereof. A flange 13 is formed in a width direction end part of the lead frame of the upper roller 11 which protrudes from an end part of the lead frame 1 and presses the runner 3 at right angles to a lead frame movement direction.
申请公布号 JPH05315379(A) 申请公布日期 1993.11.26
申请号 JP19920119372 申请日期 1992.05.13
申请人 NEC KANSAI LTD 发明人 SUGIUCHI SHINJI
分类号 B29C45/02;B29C45/14;B29C45/17;B29C45/38;B29L31/34;H01L21/56;(IPC1-7):H01L21/56 主分类号 B29C45/02
代理机构 代理人
主权项
地址