| 发明名称 |
STACKED DEVICES FOR MULTICHIP MODULES |
| 摘要 |
A packaging technique for multichip modules including a three dimensional stack of IC's (150) each having a beveled edge and a contact pad for electrically connecting the contact pads to a circuit substrate (160). |
| 申请公布号 |
WO9323982(A1) |
申请公布日期 |
1993.11.25 |
| 申请号 |
WO1993US04416 |
申请日期 |
1993.05.10 |
| 申请人 |
NCHIP, INC. |
发明人 |
TUCKERMAN, DAVID, B.;BRATHWAITE, NICHOLAS, E.;MARELLA, PAUL;FLATOW, KIRK |
| 分类号 |
H01L21/58;H01L21/60;H01L25/065;H01L29/06 |
主分类号 |
H01L21/58 |
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