| 发明名称 |
A METHOD FOR MOUNTING A WIRING BOARD ON A LIQUID CRYSTAL DISPLAY SUBSTRATE |
| 摘要 |
A method for mounting a semiconductor chip on a first wire board, bonding a second wire board to a connecting terminal of the first wire board with a thermo-setting layer of anisotropic conductivity, covering the undersurface and periphery of the semiconductor chip by a first thermo-setting epoxy resin so as to embed and seal the semiconductor chip therein, and cover the connecting part of the first wire board and the second wire board by a second thermo-setting epoxy resin. <IMAGE> |
| 申请公布号 |
EP0543635(A3) |
申请公布日期 |
1993.11.24 |
| 申请号 |
EP19920310514 |
申请日期 |
1992.11.18 |
| 申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
OHNUMA, YOSHINAO;TAGUSA, YASUNOBU |
| 分类号 |
G02F1/1345;G02F1/13;H01L21/56;H01L21/58;H01L21/60;(IPC1-7):H01L21/58 |
主分类号 |
G02F1/1345 |
| 代理机构 |
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代理人 |
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