| 摘要 |
In a chip-carrier provided with a chip-carrier substrate, a chip-carrier cover and an IC chip, said IC chip being arranged at a distance from a circuit surface of the IC chip being directed toward the chip-carrier substrate, an alpha -ray shielding film made of film material containing few radioactive elements, and adhered to a surface of the chip-carrier substrate facing the IC chip or to the circuit surface of the IC chip is provided for protecting the IC chip from the IC chip.
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