发明名称 HIGH DENSITY ITO SINTERED COMPACT AND SPUTTERING TARGET
摘要 PURPOSE:To produce an ITO sputtering target ensuring a high sputtering rate and excellent in nodule controlling and cracking preventing properties by preparing a high density ITO sintered compact having specified sintering density and grain diameter. CONSTITUTION:Indium oxide powder having about 2mum average particle diameter is mixed with about <=20wt.% tin oxide powder having about 0.2-2mum average particle diameter and this powdery mixture is compacted by die compacting or other method. The resulting compact is repeatedly pressed with a cold isostatic press under about 3-5t/cm<2> pressure and sintering is carried out at about 1,250-1,600 deg.C to produce an ITO sintered compact having 90-100% sintering density and 1-20mum grain diameter. This sintered compact has high heat conductivity, high deflective strength and about <=1X10<-3>OMEGA.cm specific resistance. When it is used as a target, the highest sputtering rate is attained and the cracking of the target and the generation of nodules on the surface of the target can effectively be prevented.
申请公布号 JPH05311428(A) 申请公布日期 1993.11.22
申请号 JP19920143652 申请日期 1992.05.11
申请人 TOSOH CORP 发明人 YOSHIMURA RYOJI;KUMA KIMITAKA;YAMAMOTO KAZUAKI;OGAWA NOBUHIRO;MORI TAKASHI
分类号 C04B35/457;C04B35/00;C23C14/34 主分类号 C04B35/457
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