| 摘要 |
PURPOSE:To obtain a metal mask of high precision for microelectronics by etching an electrically conductive metal sheet to make a specified through hole; filling a low m.p. metal in the hole; forming a resist pattern on the metal; plating the metal surface; and removing the resist and the low m.p. metal. CONSTITUTION:On electrically conductive metal sheet 1 resist 2 of a pattern a size lager than a predetermined pattern in formed, and sheet 1 is etched with an etching solution to make through hole 3. After removing resist 2 low m.p. metal 4 such as solder is filled in hole 3, and surface 5 is polished. On polished metal 4 resist 6 of a predetermined pattern is formed, and metals 1, 4 are plated with Ni, Cu or the like to form film 7. Finally resist 6 and metal 4 are removed to obtain a metal mask having hole 8 of the predetermined patter. This mask is tough and highly precise. |
